The Multi-Band OFDM Alliance (MBOA), whose aim is to set the standard for the short-distance, high-speed wireless technology called Ultra Wideband (UWB), announced on Jan 27 a strategy that it would not wait for a conclusion by IEEE, but make the MBOA specification a defacto standard by May 2004.
The MBOA expects UWB to be applied to the communication between home server and audiovisual equipment at home, wireless USB 2.0, and other items.
At present, the forces whose target is to set the standard for UWB are largely divided into two. One is the MBOA group, with Intel Corp and Texas Instruments Inc of the US as its core members. The other group has Motorola Inc and XtremeSpectrum Inc of the US as its core members.
The group that wins at least a 75% consensus in a vote among IEEE 802.15 working group members will set the standard. However, a conclusion has not been reached yet.
According to MBOA, which has a membership of 50-plus companies, one reason that the standardization is making little progress is because there is no restriction on the number of members each company can bring into the IEEE 802.15 working group. Despite MBOA having an overwhelming advantage in its number of supporting companies, when the companies from the opposing force bring in many members, it is difficult to win at least 75% of the vote among the members.
MBOA says that if the situation persists and takes such a long time for standardization at IEEE, technology development, which should be of prime importance, will suffer. Therefore, MBOA will established a Special Interest Group (SIG) at the end of the first quarter of 2004, and announce the MBOA specification “release 1.0” without a conclusion by IEEE in May 2004.
It is planned that devices will be developed using this specification, and shipment of silicon samples and integrated modules will be launched in the fourth quarter of 2004 and the first quarter of 2005, respectively. Installation to final products will begin in the second quarter of 2005. Of course, proposals to IEEE will be continued simultaneously.
MBOA will standardize the PHY layer and MAC layer. It will adopt WiMedia, IEEE1394, and Wireless USB for the upper layers. MBOA will also work on interoperability with the WiMedia Alliance, which is expected to fill the Wi-Fi Alliance for wireless LANs.
Chips for UWB that MBOA is planning are expected to be produced entirely using the Si-CMOS process, including an RF circuit. Specific target figures started to become available; when produced using its 90nm CMOS process, the transmission speeds reach 480Mbps, 200Mbps and 110Mbps, within 3m, 6m and 11m, respectively.
While the average power consumption is said to be 250mW, the actual value at the time of standardization likely will be further reduced slightly.
Source : neasia.nikkeibp.com